%0 Journal Article %1 journals/mr/JansenQEBKPS09 %A Jansen, Kaspar M. B. %A Qian, C. %A Ernst, Leo J. %A Bohm, C. %A Kessler, A. %A Preu, Harald %A Stecher, Matthias %D 2009 %J Microelectronics Reliability %K dblp %N 8 %P 872-876 %T Modeling and characterization of molding compound properties during cure. %U http://dblp.uni-trier.de/db/journals/mr/mr49.html#JansenQEBKPS09 %V 49

@article{journals/mr/JansenQEBKPS09, added-at = {2015-03-03T00:00:00.000+0100}, author = {Jansen, Kaspar M. B. and Qian, C. and Ernst, Leo J. and Bohm, C. and Kessler, A. and Preu, Harald and Stecher, Matthias}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/21ccca5bbd4dc2841a7a640fa07974bec/dblp}, ee = {http://dx.doi.org/10.1016/j.microrel.2009.03.007}, interhash = {007586e86a8b6eb8d8c05d3912ee7a02}, intrahash = {1ccca5bbd4dc2841a7a640fa07974bec}, journal = {Microelectronics Reliability}, keywords = {dblp}, number = 8, pages = {872-876}, timestamp = {2016-02-02T02:01:15.000+0100}, title = {Modeling and characterization of molding compound properties during cure.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr49.html#JansenQEBKPS09}, volume = 49, year = 2009 }