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%0 Journal Article
%1 journals/mr/JansenQEBKPS09
%A Jansen, Kaspar M. B.
%A Qian, C.
%A Ernst, Leo J.
%A Bohm, C.
%A Kessler, A.
%A Preu, Harald
%A Stecher, Matthias
%D 2009
%J Microelectronics Reliability
%K dblp
%N 8
%P 872-876
%T Modeling and characterization of molding compound properties during cure.
%U http://dblp.uni-trier.de/db/journals/mr/mr49.html#JansenQEBKPS09
%V 49
@article{journals/mr/JansenQEBKPS09,
added-at = {2015-03-03T00:00:00.000+0100},
author = {Jansen, Kaspar M. B. and Qian, C. and Ernst, Leo J. and Bohm, C. and Kessler, A. and Preu, Harald and Stecher, Matthias},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/21ccca5bbd4dc2841a7a640fa07974bec/dblp},
ee = {http://dx.doi.org/10.1016/j.microrel.2009.03.007},
interhash = {007586e86a8b6eb8d8c05d3912ee7a02},
intrahash = {1ccca5bbd4dc2841a7a640fa07974bec},
journal = {Microelectronics Reliability},
keywords = {dblp},
number = 8,
pages = {872-876},
timestamp = {2016-02-02T02:01:15.000+0100},
title = {Modeling and characterization of molding compound properties during cure.},
url = {http://dblp.uni-trier.de/db/journals/mr/mr49.html#JansenQEBKPS09},
volume = 49,
year = 2009
}