%0 Conference Paper %1 conf/bmei/ZhongDYY12 %A Zhong, Fang %A Dong, Tao %A Yong, He %A Yan, Su %B BMEI %D 2012 %E Zhang, Tianqi %I IEEE %K dblp %P 757-760 %T Low-temperature void-free wafer-level adhesive bonding for thin film transfer by nano-imprint resist. %U http://dblp.uni-trier.de/db/conf/bmei/bmei2012.html#ZhongDYY12 %@ 978-1-4673-1183-0

@inproceedings{conf/bmei/ZhongDYY12, added-at = {2014-10-17T00:00:00.000+0200}, author = {Zhong, Fang and Dong, Tao and Yong, He and Yan, Su}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2c496da71a2b62a014a8f73de47efe6d5/dblp}, booktitle = {BMEI}, crossref = {conf/bmei/2012}, editor = {Zhang, Tianqi}, ee = {http://dx.doi.org/10.1109/BMEI.2012.6513169}, interhash = {f788a8dd99e01c99264460940a653654}, intrahash = {c496da71a2b62a014a8f73de47efe6d5}, isbn = {978-1-4673-1183-0}, keywords = {dblp}, pages = {757-760}, publisher = {IEEE}, timestamp = {2016-02-02T15:13:34.000+0100}, title = {Low-temperature void-free wafer-level adhesive bonding for thin film transfer by nano-imprint resist.}, url = {http://dblp.uni-trier.de/db/conf/bmei/bmei2012.html#ZhongDYY12}, year = 2012 }