Inproceedings,

Characterization of high-resistivity polycrystalline silicon substrates for wafer-level packaging and integration of RF passives

, , , , , and .
The Fifth International Conference on Advanced Semiconductor Devices and Microsystems, 2004. ASDAM 2004., page 227-230. Piscataway, New Jersey, IEEE, (2004)
DOI: 10.1109/ASDAM.2004.1441202

Meta data

Tags

Users

  • @kevin.konnerth

Comments and Reviews