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%0 Journal Article
%1 journals/mr/WeberHHKSHBJNNF01
%A Weber, D.
%A Höhnsdorf, F.
%A Hausmann, A.
%A Klipp, A.
%A Stavreva, Z.
%A Herrmann, J.
%A Bauch, L.
%A Junack, M.
%A Neef, H.
%A Nichterwitz, M.
%A Finsterbusch, S.
%D 2001
%J Microelectronics Reliability
%K dblp
%N 7
%P 1081-1083
%T Impact of substituting SiO2 ILD by low k materials into AlCu RIE metallization.
%U http://dblp.uni-trier.de/db/journals/mr/mr41.html#WeberHHKSHBJNNF01
%V 41
@article{journals/mr/WeberHHKSHBJNNF01,
added-at = {2007-03-25T00:00:00.000+0100},
author = {Weber, D. and Höhnsdorf, F. and Hausmann, A. and Klipp, A. and Stavreva, Z. and Herrmann, J. and Bauch, L. and Junack, M. and Neef, H. and Nichterwitz, M. and Finsterbusch, S.},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2d3999e6e495bf582a180f3e960fb7feb/dblp},
ee = {http://dx.doi.org/10.1016/S0026-2714(01)00077-4},
interhash = {e4114196500dff63893091bb626136fc},
intrahash = {d3999e6e495bf582a180f3e960fb7feb},
journal = {Microelectronics Reliability},
keywords = {dblp},
number = 7,
pages = {1081-1083},
timestamp = {2016-02-02T02:02:14.000+0100},
title = {Impact of substituting SiO2 ILD by low k materials into AlCu RIE metallization.},
url = {http://dblp.uni-trier.de/db/journals/mr/mr41.html#WeberHHKSHBJNNF01},
volume = 41,
year = 2001
}
