%0 Journal Article %1 journals/mr/GaoWGCC11 %A Gao, Li-Lan %A Wang, Lei %A Gao, Hong %A Chen, Gang %A Chen, Xu %D 2011 %J Microelectronics Reliability %K dblp %N 8 %P 1393-1397 %T Fatigue life evaluation of anisotropic conductive adhesive film joints under mechanical and hygrothermal loads. %U http://dblp.uni-trier.de/db/journals/mr/mr51.html#GaoWGCC11 %V 51

@article{journals/mr/GaoWGCC11, added-at = {2011-07-08T00:00:00.000+0200}, author = {Gao, Li-Lan and Wang, Lei and Gao, Hong and Chen, Gang and Chen, Xu}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2dd57d9b23d8e7b2c180990b7d77af8f4/dblp}, ee = {http://dx.doi.org/10.1016/j.microrel.2011.03.032}, interhash = {d7853e959d0347bb5e451a2b30207d73}, intrahash = {dd57d9b23d8e7b2c180990b7d77af8f4}, journal = {Microelectronics Reliability}, keywords = {dblp}, number = 8, pages = {1393-1397}, timestamp = {2016-02-02T02:00:31.000+0100}, title = {Fatigue life evaluation of anisotropic conductive adhesive film joints under mechanical and hygrothermal loads.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr51.html#GaoWGCC11}, volume = 51, year = 2011 }