%0 Conference Paper %1 bartek2005vertical %A Bartek, Marian %A Sinaga, Saoer %A Burghartz, Joachim N. %B Conference programme & proceedings : 15th European Microelectronics and Packaging Conference & Exhibition : June 12 - 15, 2005, Brugge, Belgium %D 2005 %K INES nomoreinformation %P 190-194 %T Vertical Integration of RF Passive Components in Stacked Wafer-Level Packages

@inproceedings{bartek2005vertical, added-at = {2019-03-21T15:28:34.000+0100}, author = {Bartek, Marian and Sinaga, Saoer and Burghartz, Joachim N.}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2279ba3a85a1ae00957dd7f90b4548265/kevin.konnerth}, booktitle = {Conference programme & proceedings : 15th European Microelectronics and Packaging Conference & Exhibition : June 12 - 15, 2005, Brugge, Belgium}, eventdate = {2005-06-12/2005-06-15}, eventtitle = {15th European Microelectronics and Packaging Conference & Exhibition}, interhash = {d2338f3fb25fbf2ed856b10dab7c2cda}, intrahash = {279ba3a85a1ae00957dd7f90b4548265}, keywords = {INES nomoreinformation}, pages = {190-194}, timestamp = {2019-03-21T14:35:01.000+0100}, title = {Vertical Integration of RF Passive Components in Stacked Wafer-Level Packages}, venue = {Brugge, Belgium}, year = 2005 }