%0 Conference Paper %1 conf/3dic/KhanAH09 %A Khan, Nauman H. %A Alam, Syed M. %A Hassoun, Soha %B 3DIC %D 2009 %I IEEE %K dblp %P 1-7 %T Through-Silicon Via (TSV)-induced noise characterization and noise mitigation using coaxial TSVs. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2009.html#KhanAH09 %@ 978-1-4244-4512-7

@inproceedings{conf/3dic/KhanAH09, added-at = {2010-03-24T00:00:00.000+0100}, author = {Khan, Nauman H. and Alam, Syed M. and Hassoun, Soha}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/29efd074986270d779553e44211c987c7/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2009}, ee = {http://dx.doi.org/10.1109/3DIC.2009.5306579}, interhash = {cfe82e842b57ac76dab4c64274ae1c59}, intrahash = {9efd074986270d779553e44211c987c7}, isbn = {978-1-4244-4512-7}, keywords = {dblp}, pages = {1-7}, publisher = {IEEE}, timestamp = {2016-02-02T14:29:06.000+0100}, title = {Through-Silicon Via (TSV)-induced noise characterization and noise mitigation using coaxial TSVs.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2009.html#KhanAH09}, year = 2009 }