%0 Conference Paper %1 petillon2021conductive %A Petillon, Simon %A Haeußler, Felix %A Weser, Sascha %A Haybat, Mehmet %A Eberhardt, Wolfgang %A Franke, Joerg %A Zimmermann, André %B Proceedings of the 14th International Congress Molded Interconnect Devices %D 2021 %E Franke, Joerg %E Braeuer, Philipp %E Goth, Christian %E Pojtinger, Andreas %E Landvogt, Silke %E Kriebitzsch, Ingo %K ifm_conf petillon zimmermann %P 570-594 %T 3D Conductive Tracks on Thermoset Packages for Advanced System Integration %@ 978-3-00-068098-4

@inproceedings{petillon2021conductive, added-at = {2023-09-01T21:43:35.000+0200}, author = {Petillon, Simon and Haeußler, Felix and Weser, Sascha and Haybat, Mehmet and Eberhardt, Wolfgang and Franke, Joerg and Zimmermann, André}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/26b9c859a7f2aea351bf050bb11990423/ifm}, booktitle = {Proceedings of the 14th International Congress Molded Interconnect Devices}, editor = {Franke, Joerg and Braeuer, Philipp and Goth, Christian and Pojtinger, Andreas and Landvogt, Silke and Kriebitzsch, Ingo}, eventtitle = {14th International Congress Molded Interconnect Devices}, interhash = {6e5a989204a3830b19c8885f40fa85bb}, intrahash = {6b9c859a7f2aea351bf050bb11990423}, isbn = {978-3-00-068098-4}, issn = {2197-6090}, keywords = {ifm_conf petillon zimmermann}, month = {02}, organization = {Molded Interconnect Devices 3-D MID e. V.}, pages = {570-594}, timestamp = {2023-09-01T21:43:52.000+0200}, title = {3D Conductive Tracks on Thermoset Packages for Advanced System Integration}, venue = {Nuernberg}, year = 2021 }