%0 Conference Paper %1 conf/aspdac/QianLCZY13 %A Qian, Hanhua %A Liang, Hao %A Chang, Chip-Hong %A Zhang, Wei %A Yu, Hao %B ASP-DAC %D 2013 %I IEEE %K dblp %P 485-490 %T Thermal simulator of 3D-IC with modeling of anisotropic TSV conductance and microchannel entrance effects. %U http://dblp.uni-trier.de/db/conf/aspdac/aspdac2013.html#QianLCZY13 %@ 978-1-4673-3029-9

@inproceedings{conf/aspdac/QianLCZY13, added-at = {2013-05-03T00:00:00.000+0200}, author = {Qian, Hanhua and Liang, Hao and Chang, Chip-Hong and Zhang, Wei and Yu, Hao}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2d31b213d8cedb7c91030a83afc4927fa/dblp}, booktitle = {ASP-DAC}, crossref = {conf/aspdac/2013}, ee = {http://dx.doi.org/10.1109/ASPDAC.2013.6509643}, interhash = {5c6cb9cc018e0a48954d5a30ad08d139}, intrahash = {d31b213d8cedb7c91030a83afc4927fa}, isbn = {978-1-4673-3029-9}, keywords = {dblp}, pages = {485-490}, publisher = {IEEE}, timestamp = {2016-02-02T13:14:37.000+0100}, title = {Thermal simulator of 3D-IC with modeling of anisotropic TSV conductance and microchannel entrance effects.}, url = {http://dblp.uni-trier.de/db/conf/aspdac/aspdac2013.html#QianLCZY13}, year = 2013 }