Inproceedings,

Hybrid Systems in Foil (HySiF) Exploiting Ultra-Thin Flexible Chips

, , , , , and .
2014 44th European Solid State Device Research Conference (ESSDERC), page 210-213. Piscataway, New Jersey, IEEE, (2014)
DOI: 10.1109/ESSDERC.2014.6948797

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