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%0 Journal Article
%1 journals/mr/RongenRWVSW14
%A Rongen, R. T. H.
%A Roucou, R.
%A vd Wel, P. J.
%A Voogt, F. C.
%A Swartjes, F.
%A Weide-Zaage, Kirsten
%D 2014
%J Microelectronics Reliability
%K dblp
%N 9-10
%P 1988-1994
%T Reliability of Wafer Level Chip Scale Packages.
%U http://dblp.uni-trier.de/db/journals/mr/mr54.html#RongenRWVSW14
%V 54
@article{journals/mr/RongenRWVSW14,
added-at = {2015-03-03T00:00:00.000+0100},
author = {Rongen, R. T. H. and Roucou, R. and vd Wel, P. J. and Voogt, F. C. and Swartjes, F. and Weide-Zaage, Kirsten},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/298c40d605ddb214e1f0e53b7f111ffb8/dblp},
ee = {http://dx.doi.org/10.1016/j.microrel.2014.07.012},
interhash = {4a0efb88ac5b88bae6e87c74bc549ab0},
intrahash = {98c40d605ddb214e1f0e53b7f111ffb8},
journal = {Microelectronics Reliability},
keywords = {dblp},
number = {9-10},
pages = {1988-1994},
timestamp = {2016-02-02T02:00:09.000+0100},
title = {Reliability of Wafer Level Chip Scale Packages.},
url = {http://dblp.uni-trier.de/db/journals/mr/mr54.html#RongenRWVSW14},
volume = 54,
year = 2014
}
