%0 Journal Article %1 Acuna_CIPS2020 %A Acuna, J. %A Afanasenkoa, V. %A Rupp, T. %A Sonner, M. %A Kallfass, I. %D 2020 %J in Proc. 11th International Conference on Integrated Power Electronics Systems, CIPS, Berlin %K imported %T Fast Thermomechanical Simulation of Power Module Die-Attach Layers using Neural Networks

@article{Acuna_CIPS2020, added-at = {2020-09-07T14:26:58.000+0200}, author = {Acuna, J. and Afanasenkoa, V. and Rupp, T. and Sonner, M. and Kallfass, I.}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2fa256576e098d1cd68408e0dee70eb7d/ingmarkallfass}, interhash = {06609c029b321200d3b03f20b082e5e3}, intrahash = {fa256576e098d1cd68408e0dee70eb7d}, journal = {in Proc. 11th International Conference on Integrated Power Electronics Systems, CIPS, Berlin}, keywords = {imported}, timestamp = {2022-11-04T10:48:48.000+0100}, title = {{Fast Thermomechanical Simulation of Power Module Die-Attach Layers using Neural Networks}}, year = 2020 }