%0 Thesis %1 kulkarni2022reliability %A Kulkarni, Romit %B Ingenieurwissenschaften %C München %D 2022 %I Verlag Dr. Hut %K diss phf07 ubs_10007 ubs_20011 ubs_30108 unibibliografie %T Reliability study of electronic components on board-level packages encapsulated by thermoset injection molding %@ 978-3-8439-5275-0

@phdthesis{kulkarni2022reliability, added-at = {2023-06-28T10:26:48.000+0200}, address = {München}, author = {Kulkarni, Romit}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2f46c26bf5399aa4996a9a23cdd9568e0/unibiblio-3}, eventdate = {2022-10-24}, interhash = {b4b112413f04937749d92598f0ccc579}, intrahash = {f46c26bf5399aa4996a9a23cdd9568e0}, isbn = {978-3-8439-5275-0}, keywords = {diss phf07 ubs_10007 ubs_20011 ubs_30108 unibibliografie}, language = {eng}, publisher = {Verlag Dr. Hut}, school = {Universität Stuttgart}, series = {Ingenieurwissenschaften}, supervisor = {Zimmermann, André}, supervisorgnd = {114014409X}, timestamp = {2023-06-28T10:26:48.000+0200}, title = {Reliability study of electronic components on board-level packages encapsulated by thermoset injection molding}, type = {Dissertation}, year = 2022 }