Packaging represents an important part in microintegration of sensors based on MEMS. Besides functionality and reliability, miniaturization and integration density in combination with high variant diversity or low volume production and consequently a high flexibility in packaging design at moderate costs are the requirements for future packaging solutions. This study investigates possibilities employing PCB based assemblies to provide high flexibility for circuit designs together with film assisted transfer molding (FAM) to package sensors. The investigations successfully demonstrate the feasibility of FAM in combination with PCB and MEMS for image and inertial sensors as well as for standard ASIC packaging with QFN. The results prove the technology to be a versatile method for low cost packaging of flexible designs for small series production.
%0 Conference Paper
%1 heraflexible
%A Hera, Daniel
%A Schulze Spüntrup, Jan Dirk
%A Günther, Thomas
%A Harendt, Christine
%A Berndt, Armin
%A Reuter, Christian
%A Fritz, Karl-Peter
%A Kück, Heinz
%A Zimmermann, André
%D 2015
%K myown myownsend:unibiblio
%T Flexible packaging by film assisted molding for microintegration of MEMS based sensors
%X Packaging represents an important part in microintegration of sensors based on MEMS. Besides functionality and reliability, miniaturization and integration density in combination with high variant diversity or low volume production and consequently a high flexibility in packaging design at moderate costs are the requirements for future packaging solutions. This study investigates possibilities employing PCB based assemblies to provide high flexibility for circuit designs together with film assisted transfer molding (FAM) to package sensors. The investigations successfully demonstrate the feasibility of FAM in combination with PCB and MEMS for image and inertial sensors as well as for standard ASIC packaging with QFN. The results prove the technology to be a versatile method for low cost packaging of flexible designs for small series production.
%@ 978-0-9568086-1-5
@inproceedings{heraflexible,
abstract = {Packaging represents an important part in microintegration of sensors based on MEMS. Besides functionality and reliability, miniaturization and integration density in combination with high variant diversity or low volume production and consequently a high flexibility in packaging design at moderate costs are the requirements for future packaging solutions. This study investigates possibilities employing PCB based assemblies to provide high flexibility for circuit designs together with film assisted transfer molding (FAM) to package sensors. The investigations successfully demonstrate the feasibility of FAM in combination with PCB and MEMS for image and inertial sensors as well as for standard ASIC packaging with QFN. The results prove the technology to be a versatile method for low cost packaging of flexible designs for small series production.},
added-at = {2019-03-15T13:36:18.000+0100},
author = {Hera, Daniel and Schulze Spüntrup, Jan Dirk and Günther, Thomas and Harendt, Christine and Berndt, Armin and Reuter, Christian and Fritz, Karl-Peter and Kück, Heinz and Zimmermann, André},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/28f4bd57c740e9b112efae1c98a923d91/thomasguenther},
eventdate = {September},
eventtitle = {European Microelectronics and Packaging Conference & Exhibition},
interhash = {9ba4e7db41716a0222e985822634b67b},
intrahash = {8f4bd57c740e9b112efae1c98a923d91},
isbn = {978-0-9568086-1-5},
keywords = {myown myownsend:unibiblio},
timestamp = {2022-07-25T11:36:22.000+0200},
title = {Flexible packaging by film assisted molding for microintegration of MEMS based sensors},
venue = {Friedrichshafen, Germany},
year = 2015
}
