This work explores intrinsic and extrinsic mechanical stress effects in mode-split, open-loop MEMS gyroscopes. First, the impact of stress on the deformation of a single MEMS die is experimentally investigated with white light interferometry. Only a small amount of the observed deformation of the MEMS die is found to be caused by soldering stress, whereas the main amount originates from the die attach film. In the second part of the paper, zero-rate offset drift across PCB bending is investigated using MEMS gyroscope prototype devices in LGA mold packages. While most of the offset drift can be attributed to changes of quadrature and mechanical phase error as expected, a smaller cross-axis offset contribution is demonstrated as well. Our investigation forms a further building block towards understanding root-causes of cross-axis sensitivity.
%0 Journal Article
%1 mayer2023investigating
%A Mayer, Wolfram
%A Kuhlmann, Burkhard
%A Hiller, Tobias
%A Balslink, Thorsten
%A Kunz, Ulrich
%A Zimmermann, Andre
%D 2023
%J IEEE Sensors Letters
%K ifm_article mayer zimmermann
%P 1-4
%R 10.1109/LSENS.2023.3335095
%T Investigating the Effects of Stress on Die Deformation and on Cross-Axis Offset Drift in Mode-Split MEMS Gyroscopes
%X This work explores intrinsic and extrinsic mechanical stress effects in mode-split, open-loop MEMS gyroscopes. First, the impact of stress on the deformation of a single MEMS die is experimentally investigated with white light interferometry. Only a small amount of the observed deformation of the MEMS die is found to be caused by soldering stress, whereas the main amount originates from the die attach film. In the second part of the paper, zero-rate offset drift across PCB bending is investigated using MEMS gyroscope prototype devices in LGA mold packages. While most of the offset drift can be attributed to changes of quadrature and mechanical phase error as expected, a smaller cross-axis offset contribution is demonstrated as well. Our investigation forms a further building block towards understanding root-causes of cross-axis sensitivity.
@article{mayer2023investigating,
abstract = {This work explores intrinsic and extrinsic mechanical stress effects in mode-split, open-loop MEMS gyroscopes. First, the impact of stress on the deformation of a single MEMS die is experimentally investigated with white light interferometry. Only a small amount of the observed deformation of the MEMS die is found to be caused by soldering stress, whereas the main amount originates from the die attach film. In the second part of the paper, zero-rate offset drift across PCB bending is investigated using MEMS gyroscope prototype devices in LGA mold packages. While most of the offset drift can be attributed to changes of quadrature and mechanical phase error as expected, a smaller cross-axis offset contribution is demonstrated as well. Our investigation forms a further building block towards understanding root-causes of cross-axis sensitivity.},
added-at = {2023-12-11T13:37:52.000+0100},
author = {Mayer, Wolfram and Kuhlmann, Burkhard and Hiller, Tobias and Balslink, Thorsten and Kunz, Ulrich and Zimmermann, Andre},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/285a701848f9a01bd5fc0f88f8fdf222f/holgerruehl},
doi = {10.1109/LSENS.2023.3335095},
interhash = {1ba1598c4c94901d0aad0b8d6d09a8aa},
intrahash = {85a701848f9a01bd5fc0f88f8fdf222f},
issn = {2475-1472},
journal = {IEEE Sensors Letters},
keywords = {ifm_article mayer zimmermann},
pages = {1-4},
timestamp = {2023-12-11T13:37:52.000+0100},
title = {Investigating the Effects of Stress on Die Deformation and on Cross-Axis Offset Drift in Mode-Split MEMS Gyroscopes},
year = 2023
}
