%0 Conference Paper %1 matic2012printing %A Matic, Vladimir %A Keck, Juergen %A Polzinger, Bernhard %A Eberhardt, Wolfgang %A Kueck, Heinz %B Proceedings of the 9th International Conference on Multi-Material Micro Manufacture (4M 2012) %D 2012 %E Noll, Humbert %E Adamovic, Nadja %E Dimov, Stefan %I Research Publishing %K ifm_conf kueck polzinger %P 152-156 %R 10.3850/978-981-07-3353-7_323 %T Printing of Functional Silver Structures on Polymer Based 3D-Packages %X Printed electronics provides new perspectives for the manufacturing of highly innovative low cost polymer based packages. Conventional printing technologes such as screen printing, offset printing, inkjet printing and the Aerosol Jet process meet the requirements of miniaturised systems. Because of a variety of functional inks passive devices such as resistors and capacitors as well as acitve devices such as transistors can be fabricated. The new promising field of appication for printed electronics is the fabrication of 3D polymer packages by directly printing on 3D-substrates. This paper presents first print studies on 3D-substrates using inkjet printing as well as Aerosol Jet process. Conductive silver tracks were printed via inkjet on a 3D thermoplastic substrate topology and via Aerosol Jet process for chip interconnection as well as in a cavity of an epoxy laminated substrate (FR4). Nanoparticle-based silver inks were used for both printing processes. %@ 978-981-07-3353-7

@inproceedings{matic2012printing, abstract = {Printed electronics provides new perspectives for the manufacturing of highly innovative low cost polymer based packages. Conventional printing technologes such as screen printing, offset printing, inkjet printing and the Aerosol Jet process meet the requirements of miniaturised systems. Because of a variety of functional inks passive devices such as resistors and capacitors as well as acitve devices such as transistors can be fabricated. The new promising field of appication for printed electronics is the fabrication of 3D polymer packages by directly printing on 3D-substrates. This paper presents first print studies on 3D-substrates using inkjet printing as well as Aerosol Jet process. Conductive silver tracks were printed via inkjet on a 3D thermoplastic substrate topology and via Aerosol Jet process for chip interconnection as well as in a cavity of an epoxy laminated substrate (FR4). Nanoparticle-based silver inks were used for both printing processes.}, added-at = {2023-06-16T06:51:28.000+0200}, author = {Matic, Vladimir and Keck, Juergen and Polzinger, Bernhard and Eberhardt, Wolfgang and Kueck, Heinz}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/27acffcd4602750b2cbab7e0cb8fb3122/holgerruehl}, booktitle = {Proceedings of the 9th International Conference on Multi-Material Micro Manufacture (4M 2012)}, doi = {10.3850/978-981-07-3353-7_323}, editor = {Noll, Humbert and Adamovic, Nadja and Dimov, Stefan}, eventtitle = {9th International Conference on Multi-Material Micro Manufacture}, interhash = {ceda963f306501cdaf468c0531212596}, intrahash = {7acffcd4602750b2cbab7e0cb8fb3122}, isbn = {978-981-07-3353-7}, keywords = {ifm_conf kueck polzinger}, month = {10}, organization = {4M Association}, pages = {152-156}, publisher = {Research Publishing}, timestamp = {2023-06-16T06:51:28.000+0200}, title = {Printing of Functional Silver Structures on Polymer Based 3D-Packages}, venue = {Wien}, year = 2012 }