%0 Conference Paper
%1 petillon2021conductive
%A Petillon, Simon
%A Haeußler, Felix
%A Weser, Sascha
%A Haybat, Mehmet
%A Eberhardt, Wolfgang
%A Franke, Joerg
%A Zimmermann, André
%B Proceedings of the 14th International Congress Molded Interconnect Devices
%D 2021
%E Franke, Joerg
%E Braeuer, Philipp
%E Goth, Christian
%E Pojtinger, Andreas
%E Landvogt, Silke
%E Kriebitzsch, Ingo
%K ifm_conf petillon zimmermann
%P 570-594
%T 3D Conductive Tracks on Thermoset Packages for Advanced System Integration
%@ 978-3-00-068098-4
@inproceedings{petillon2021conductive,
added-at = {2023-09-01T21:43:35.000+0200},
author = {Petillon, Simon and Haeußler, Felix and Weser, Sascha and Haybat, Mehmet and Eberhardt, Wolfgang and Franke, Joerg and Zimmermann, André},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/26b9c859a7f2aea351bf050bb11990423/ifm},
booktitle = {Proceedings of the 14th International Congress Molded Interconnect Devices},
editor = {Franke, Joerg and Braeuer, Philipp and Goth, Christian and Pojtinger, Andreas and Landvogt, Silke and Kriebitzsch, Ingo},
eventtitle = {14th International Congress Molded Interconnect Devices},
interhash = {6e5a989204a3830b19c8885f40fa85bb},
intrahash = {6b9c859a7f2aea351bf050bb11990423},
isbn = {978-3-00-068098-4},
issn = {2197-6090},
keywords = {ifm_conf petillon zimmermann},
month = {02},
organization = {Molded Interconnect Devices 3-D MID e. V.},
pages = {570-594},
timestamp = {2023-09-01T21:43:52.000+0200},
title = {3D Conductive Tracks on Thermoset Packages for Advanced System Integration},
venue = {Nuernberg},
year = 2021
}