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Pores and Spatters reduction for Copper and Aluminium Laser Welding with MPLC Beam-Shaping Solutions

, , , , , , , , and . volume 13th CIRP Conference on Photonic Technologies [LANE 2024] of Industrial Paper 2024, (2024)

Abstract

The electric vehicle (EV) market is experiencing rapid growth, leading to a significant push towards innovation. One of the critical challenges is Copper and Aluminum laser welding. These materials are inherently more difficult to weld and the welding criteria are more stringent (limited porosity and spatters). An advanced beam shaping modules have been developed using Multi-Plane Light Conversion (MPLC) technology. The beam shaping is accomplished using two integrated mirrors positioned between the collimation block and either a focusing block or a scanner. MPLC technology enables highly flexible beam shaping. Notably, this technology offers a depth of field four times greater than dual-core technologies, significantly simplifying its application. The presentation will showcase the benefits achieved in welding real components: battery modules, busbars, and hairpins. Additionally, an X-ray analysis of the welds will be presented. Simulations of numerous beam shapes and their effects on the welding process will also be provided.

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