%0 Journal Article %1 8891790 %A Fezai, Alaa %A Sharma, Anuj %A Müller-Hirsch, Wolfgang %A Zimmermann, André %D 2020 %J IEEE Transactions on Instrumentation and Measurement %K zimmermann mueller-hirsch ifm_article from:samethalvaci sharma fezai %N 7 %P 4908-4918 %R 10.1109/TIM.2019.2950824 %T Identification of the Viscoelastic Properties of Soft Thermal Interface Layers Through Forward and Inverse Measurement Techniques %V 69 %X The design for the reliability of automotive electronics involving viscoelastic materials requires accurate knowledge of material properties under critical frequency and temperature conditions. Both forward and inverse approaches for the dynamic characterization of a soft silicone-based thermal interface material used in electronic control units are presented and discussed. The classic forward characterization implying dynamic mechanical analysis and the principle of time-temperature superposition is applied in a first step. The identified material model under critical temperature conditions is restrained to a narrow frequency range and a validation for higher frequencies is needed. The proposed inverse method presented in the second part minimizes the residue between the measured and numerical transfer functions of single-lap joint specimens at chosen control frequency ranges located at the resonances of the structure. The specimens are excited by an electrodynamic shaker situated in an environmental chamber allowing measurements under different temperature conditions. The main outcome of the inverse approach is a validation of the results of forward characterization for a broad frequency range and under critical temperature conditions adopting a simple experimental arrangement and a barely complex numerical procedure.

@article{8891790, abstract = {The design for the reliability of automotive electronics involving viscoelastic materials requires accurate knowledge of material properties under critical frequency and temperature conditions. Both forward and inverse approaches for the dynamic characterization of a soft silicone-based thermal interface material used in electronic control units are presented and discussed. The classic forward characterization implying dynamic mechanical analysis and the principle of time-temperature superposition is applied in a first step. The identified material model under critical temperature conditions is restrained to a narrow frequency range and a validation for higher frequencies is needed. The proposed inverse method presented in the second part minimizes the residue between the measured and numerical transfer functions of single-lap joint specimens at chosen control frequency ranges located at the resonances of the structure. The specimens are excited by an electrodynamic shaker situated in an environmental chamber allowing measurements under different temperature conditions. The main outcome of the inverse approach is a validation of the results of forward characterization for a broad frequency range and under critical temperature conditions adopting a simple experimental arrangement and a barely complex numerical procedure.}, added-at = {2023-06-16T15:25:28.000+0200}, author = {Fezai, Alaa and Sharma, Anuj and Müller-Hirsch, Wolfgang and Zimmermann, André}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/255568aa450cdc66878e941eeddecf229/ifm}, doi = {10.1109/TIM.2019.2950824}, interhash = {51e9ee8d7303f240b7ca623bba91fb7c}, intrahash = {55568aa450cdc66878e941eeddecf229}, journal = {IEEE Transactions on Instrumentation and Measurement}, keywords = {zimmermann mueller-hirsch ifm_article from:samethalvaci sharma fezai}, number = 7, pages = {4908-4918}, timestamp = {2023-06-16T15:25:28.000+0200}, title = {Identification of the Viscoelastic Properties of Soft Thermal Interface Layers Through Forward and Inverse Measurement Techniques}, volume = 69, year = 2020 }