This paper summarizes the results on inkjet printing and characterization of functional structures on molded 2D and 3D devices. Different injection molded thermoplastics, a transfer molded thermoset and polyimide foil as substrate materials were used. Conductive structures were obtained by inkjet printing of a commercial available silver nanoparticle ink. The use of printable acrylic based ink enabled the fabrication of conductor crossovers or multilayers. Results on inkjet printed temperature sensitive structures and an inkjet printed intrusion sensor device as well as an inkjet printed electrical interconnect on a transfer molded package will be presented.
%0 Conference Paper
%1 polzinger2014
%A Polzinger, Bernhard
%A Matic, Vladimir
%A Liedtke, Laura
%A Keck, Jürgen
%A Hera, Daniel
%A Günther, Thomas
%A Eberhardt, Wolfgang
%A Kück, Heinz
%B 11th International Congress Molded Interconnect Devices – Scientific Proceedings
%D 2014
%I Trans Tech Publications
%K myown myownsend:unibiblio
%P 37--42
%R 10.4028/www.scientific.net/AMR.1038.37
%T Printing of Functional Structures on Molded 3D Devices
%V 1038
%X This paper summarizes the results on inkjet printing and characterization of functional structures on molded 2D and 3D devices. Different injection molded thermoplastics, a transfer molded thermoset and polyimide foil as substrate materials were used. Conductive structures were obtained by inkjet printing of a commercial available silver nanoparticle ink. The use of printable acrylic based ink enabled the fabrication of conductor crossovers or multilayers. Results on inkjet printed temperature sensitive structures and an inkjet printed intrusion sensor device as well as an inkjet printed electrical interconnect on a transfer molded package will be presented.
@inproceedings{polzinger2014,
abstract = {This paper summarizes the results on inkjet printing and characterization of functional structures on molded 2D and 3D devices. Different injection molded thermoplastics, a transfer molded thermoset and polyimide foil as substrate materials were used. Conductive structures were obtained by inkjet printing of a commercial available silver nanoparticle ink. The use of printable acrylic based ink enabled the fabrication of conductor crossovers or multilayers. Results on inkjet printed temperature sensitive structures and an inkjet printed intrusion sensor device as well as an inkjet printed electrical interconnect on a transfer molded package will be presented.},
added-at = {2019-03-15T13:30:20.000+0100},
author = {Polzinger, Bernhard and Matic, Vladimir and Liedtke, Laura and Keck, J{\"{u}}rgen and Hera, Daniel and G{\"{u}}nther, Thomas and Eberhardt, Wolfgang and K{\"{u}}ck, Heinz},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/245acbe919d5dc9dd2ad400a778b89988/thomasguenther},
booktitle = {11th International Congress Molded Interconnect Devices – Scientific Proceedings},
doi = {10.4028/www.scientific.net/AMR.1038.37},
interhash = {a1a80691241ea62f770c455a82a449fe},
intrahash = {45acbe919d5dc9dd2ad400a778b89988},
keywords = {myown myownsend:unibiblio},
month = {11},
pages = {37--42},
publisher = {Trans Tech Publications},
series = {Advanced Materials Research},
timestamp = {2019-03-29T14:37:27.000+0100},
title = {Printing of Functional Structures on Molded 3D Devices},
volume = 1038,
year = 2014
}
