Abstract
With the increasingly high demand for microsystems, their packaging technologies become more and more important. Requirements of reliability as well as integration of more functionality and miniaturization in combination with a need for cheaper production cost trigger the necessity for new solutions for modular, embedded microsystems. Small and medium sized product lines for new developments in the field of optics, medical devices, sensors and automation technologies require rapid methods for production while keeping the costs moderately low. With Film Assisted Molding, the method of transfer molding can be used for manufacturing tailor made embedded microsystems with integrated functions. Due to the well matched CTE of the thermoset material, the soft compression of the ETFE foil and therefore the increased acceptable tolerances, common printed circuit boards with all their benefits like multilayer capability can be processed, leading to a much higher integration density of systems (systems in package). Additionally, multiple systems can be assembled and packaged on a single PCB board, enabling small series production. Within this study methods were developed for packaging of PCB based microsystems, including, but not limited to, standard QFN packages, image sensors as well as inertia sensors. The aim of this research is to provide proof for the possibility to employ the method as a reliable and flexible packaging solution for various advance microelectronic packages.
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