In this paper, the fabrication of coplanar waveguide (CPW) based interconnects by Ultraprecise Deposition (UPD) and their characterization in the D-band (110–170 GHz) is discussed. UPD was recently introduced by XTPL as an alternative to aerosol jet and ink jet printing technologies. Its most distin-guishing feature is that the printing nozzle is in contact with the substrate during printing, allowing for the application of highly viscous inks with a lateral precision of 1–2 µm. The high viscosity of the silver-filled ink is used to print interconnects between a Corning 1737 display glass substrate and a 100 µm thin AF-45 glass die. The interconnects are realized using low-cost dispensed dielectric ramps made of a suspension of alumina particles in an epoxy resin. This approach requires neither highly precise milling of the substrate, nor precise alignment of chip and substrate, nor a complex fabrication process for the dielectric ramps. The interconnects with an air gap of 9 µm show as little as approximately 0.65 dB of insertion loss at 160 GHz, and broadband transmission in the entire D-band.
%0 Conference Paper
%1 10485303
%A Roemhild, Martin
%A Gramlich, Georg
%A Wendel, Jonathan
%A Baur, Holger
%A Zwick, Thomas
%A Fruehauf, Norbert
%B 2024 15th German Microwave Conference (GeMiC)
%D 2024
%K igm
%P 57-60
%R 10.23919/GeMiC59120.2024.10485303
%T Ultraprecise Printing of D-Band Interconnects Using Dielectric Ramps
%X In this paper, the fabrication of coplanar waveguide (CPW) based interconnects by Ultraprecise Deposition (UPD) and their characterization in the D-band (110–170 GHz) is discussed. UPD was recently introduced by XTPL as an alternative to aerosol jet and ink jet printing technologies. Its most distin-guishing feature is that the printing nozzle is in contact with the substrate during printing, allowing for the application of highly viscous inks with a lateral precision of 1–2 µm. The high viscosity of the silver-filled ink is used to print interconnects between a Corning 1737 display glass substrate and a 100 µm thin AF-45 glass die. The interconnects are realized using low-cost dispensed dielectric ramps made of a suspension of alumina particles in an epoxy resin. This approach requires neither highly precise milling of the substrate, nor precise alignment of chip and substrate, nor a complex fabrication process for the dielectric ramps. The interconnects with an air gap of 9 µm show as little as approximately 0.65 dB of insertion loss at 160 GHz, and broadband transmission in the entire D-band.
@inproceedings{10485303,
abstract = {In this paper, the fabrication of coplanar waveguide (CPW) based interconnects by Ultraprecise Deposition (UPD) and their characterization in the D-band (110–170 GHz) is discussed. UPD was recently introduced by XTPL as an alternative to aerosol jet and ink jet printing technologies. Its most distin-guishing feature is that the printing nozzle is in contact with the substrate during printing, allowing for the application of highly viscous inks with a lateral precision of 1–2 µm. The high viscosity of the silver-filled ink is used to print interconnects between a Corning 1737 display glass substrate and a 100 µm thin AF-45 glass die. The interconnects are realized using low-cost dispensed dielectric ramps made of a suspension of alumina particles in an epoxy resin. This approach requires neither highly precise milling of the substrate, nor precise alignment of chip and substrate, nor a complex fabrication process for the dielectric ramps. The interconnects with an air gap of 9 µm show as little as approximately 0.65 dB of insertion loss at 160 GHz, and broadband transmission in the entire D-band.},
added-at = {2024-04-16T10:13:57.000+0200},
author = {Roemhild, Martin and Gramlich, Georg and Wendel, Jonathan and Baur, Holger and Zwick, Thomas and Fruehauf, Norbert},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/20f79dfd2f6547ff78861e725e2cedf15/pschalberger},
booktitle = {2024 15th German Microwave Conference (GeMiC)},
doi = {10.23919/GeMiC59120.2024.10485303},
interhash = {0d5b9cb25c9a9fd6a2066b76685871cd},
intrahash = {0f79dfd2f6547ff78861e725e2cedf15},
issn = {2167-8022},
keywords = {igm},
month = {March},
pages = {57-60},
timestamp = {2024-04-16T10:13:57.000+0200},
title = {Ultraprecise Printing of D-Band Interconnects Using Dielectric Ramps},
year = 2024
}
