%0 Conference Paper %1 Holder.2021.Scaling %A Holder, Daniel %A Weber, Rudolf %A Röcker, Christoph %A Kunz, Gerhard %A Bruneel, David %A Delaigue, Martin %A Graf, Thomas %A Abdou Ahmed, Marwan %B Proceedings of the Lasers in Manufacturing Conference 2021 %D 2021 %K myown silicon ablation from:danielholder %T Scaling the throughput of high-quality silicon laser micromachining using a 1-kW sub-picosecond laser %X Recently, laser processing of silicon with ultrafast lasers has gained widespread attention for manufacturing of optics for THz radiation, an emerging topic with applications in medical imaging, security and communication. Such THz-optics require high-quality surfaces with low roughness in order to provide high transmission and low scattering. In the past, the low average power of ultrafast lasers limited the achievable throughput in silicon laser micromachining. In this work a processing strategy for high-quality high-throughput micromachining of silicon with a 1-kW sub-picosecond laser is presented, which takes benefit of pulse bursts, low fluences and high feed rates. As a result, laser micromachining could be demonstrated as a suitable technology for manufacturing of smooth structures on silicon while maintaining a high throughput. Surfaces with an appropriate roughness of Sa ≤ 0.6 μm were produced with a high material removal rate of 230 mm³/min and a machining depth of up to 313 μm.

@inproceedings{Holder.2021.Scaling, abstract = {Recently, laser processing of silicon with ultrafast lasers has gained widespread attention for manufacturing of optics for THz radiation, an emerging topic with applications in medical imaging, security and communication. Such THz-optics require high-quality surfaces with low roughness in order to provide high transmission and low scattering. In the past, the low average power of ultrafast lasers limited the achievable throughput in silicon laser micromachining. In this work a processing strategy for high-quality high-throughput micromachining of silicon with a 1-kW sub-picosecond laser is presented, which takes benefit of pulse bursts, low fluences and high feed rates. As a result, laser micromachining could be demonstrated as a suitable technology for manufacturing of smooth structures on silicon while maintaining a high throughput. Surfaces with an appropriate roughness of Sa ≤ 0.6 μm were produced with a high material removal rate of 230 mm³/min and a machining depth of up to 313 μm.}, added-at = {2021-07-07T11:28:10.000+0200}, author = {Holder, Daniel and Weber, Rudolf and Röcker, Christoph and Kunz, Gerhard and Bruneel, David and Delaigue, Martin and Graf, Thomas and Abdou Ahmed, Marwan}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/20cb69d4d32de669f25168f5a031839a1/ifsw}, booktitle = {Proceedings of the Lasers in Manufacturing Conference 2021}, eventdate = {21.06.2021-24.06.2021}, eventtitle = {Lasers in Manufacturing Conference 2021}, interhash = {c9e751d9dc25b8c0290fd4c0eac95445}, intrahash = {0cb69d4d32de669f25168f5a031839a1}, keywords = {myown silicon ablation from:danielholder}, timestamp = {2021-07-07T09:28:10.000+0200}, title = {Scaling the throughput of high-quality silicon laser micromachining using a 1-kW sub-picosecond laser}, year = 2021 }