%0 Journal Article %1 journals/mr/ChenHLL12 %A Chen, Hongtao %A Han, Jing %A Li, Jue %A Li, Mingyu %D 2012 %J Microelectronics Reliability %K dblp %N 6 %P 1112-1120 %T Inhomogeneous deformation and microstructure evolution of Sn-Ag-based solder interconnects during thermal cycling and shear testing. %U http://dblp.uni-trier.de/db/journals/mr/mr52.html#ChenHLL12 %V 52

@article{journals/mr/ChenHLL12, added-at = {2012-06-21T00:00:00.000+0200}, author = {Chen, Hongtao and Han, Jing and Li, Jue and Li, Mingyu}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2c228f5928a7cfaf49bd3189ea96cf85c/dblp}, ee = {http://dx.doi.org/10.1016/j.microrel.2012.01.009}, interhash = {fcbe2171b8e9172bd3c4ab5a5f94a00b}, intrahash = {c228f5928a7cfaf49bd3189ea96cf85c}, journal = {Microelectronics Reliability}, keywords = {dblp}, number = 6, pages = {1112-1120}, timestamp = {2016-02-02T02:00:01.000+0100}, title = {Inhomogeneous deformation and microstructure evolution of Sn-Ag-based solder interconnects during thermal cycling and shear testing.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr52.html#ChenHLL12}, volume = 52, year = 2012 }