%0 Journal Article %1 journals/mj/ZhengGSF03 %A Zheng, Y. S. %A Guo, Q. %A Su, Y. J. %A Foo, P. D. %D 2003 %J Microelectronics Journal %K dblp %N 2 %P 109-113 %T Polymer residue chemical composition analysis and its effect on via contact resistance in dual damascene copper interconnects process integration. %U http://dblp.uni-trier.de/db/journals/mj/mj34.html#ZhengGSF03 %V 34

@article{journals/mj/ZhengGSF03, added-at = {2007-11-15T00:00:00.000+0100}, author = {Zheng, Y. S. and Guo, Q. and Su, Y. J. and Foo, P. D.}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/287d7587e547f634069db44fcffa073cb/dblp}, ee = {http://dx.doi.org/10.1016/S0026-2692(02)00154-4}, interhash = {f2139439c6791fc6f157fe67eafb370e}, intrahash = {87d7587e547f634069db44fcffa073cb}, journal = {Microelectronics Journal}, keywords = {dblp}, number = 2, pages = {109-113}, timestamp = {2016-02-02T06:52:46.000+0100}, title = {Polymer residue chemical composition analysis and its effect on via contact resistance in dual damascene copper interconnects process integration.}, url = {http://dblp.uni-trier.de/db/journals/mj/mj34.html#ZhengGSF03}, volume = 34, year = 2003 }