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%0 Journal Article
%1 journals/mr/RongenICL11
%A Rongen, R. T. H.
%A van IJzerloo, A.
%A Cotofana, C.
%A Lan, K. M.
%D 2011
%J Microelectronics Reliability
%K dblp
%N 9-11
%P 1865-1868
%T Cratering response method to study the effect of ultrasonic energy on Cu-wire bonding quality.
%U http://dblp.uni-trier.de/db/journals/mr/mr51.html#RongenICL11
%V 51
@article{journals/mr/RongenICL11,
added-at = {2011-12-19T00:00:00.000+0100},
author = {Rongen, R. T. H. and van IJzerloo, A. and Cotofana, C. and Lan, K. M.},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/21ee3118786d9267783acd60fb5605681/dblp},
ee = {http://dx.doi.org/10.1016/j.microrel.2011.07.041},
interhash = {f05b37cb8252e6e455b4acf6cf62263b},
intrahash = {1ee3118786d9267783acd60fb5605681},
journal = {Microelectronics Reliability},
keywords = {dblp},
number = {9-11},
pages = {1865-1868},
timestamp = {2016-02-02T02:01:50.000+0100},
title = {Cratering response method to study the effect of ultrasonic energy on Cu-wire bonding quality.},
url = {http://dblp.uni-trier.de/db/journals/mr/mr51.html#RongenICL11},
volume = 51,
year = 2011
}
