%0 Journal Article %1 journals/tcad/HuangHSTC13 %A Huang, Li-Ren %A Huang, Shi-Yu %A Sunter, Stephen K. %A Tsai, Kun-Han %A Cheng, Wu-Tung %D 2013 %J IEEE Trans. on CAD of Integrated Circuits and Systems %K dblp %N 9 %P 1440-1444 %T Oscillation-Based Prebond TSV Test. %U http://dblp.uni-trier.de/db/journals/tcad/tcad32.html#HuangHSTC13 %V 32

@article{journals/tcad/HuangHSTC13, added-at = {2013-11-20T00:00:00.000+0100}, author = {Huang, Li-Ren and Huang, Shi-Yu and Sunter, Stephen K. and Tsai, Kun-Han and Cheng, Wu-Tung}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/21141992ebd9684a412ae98b2530779f0/dblp}, ee = {http://dx.doi.org/10.1109/TCAD.2013.2259626}, interhash = {d83cde01e1f96c05c75a88f54a33d2ab}, intrahash = {1141992ebd9684a412ae98b2530779f0}, journal = {IEEE Trans. on CAD of Integrated Circuits and Systems}, keywords = {dblp}, number = 9, pages = {1440-1444}, timestamp = {2016-02-02T10:07:44.000+0100}, title = {Oscillation-Based Prebond TSV Test.}, url = {http://dblp.uni-trier.de/db/journals/tcad/tcad32.html#HuangHSTC13}, volume = 32, year = 2013 }