%0 Journal Article %1 journals/mr/ShenCZZH14 %A Shen, Jun %A Cao, Zhongming %A Zhai, Dajun %A Zhao, Mali %A He, Peipei %D 2014 %J Microelectronics Reliability %K dblp %N 1 %P 252-258 %T Effect of isothermal aging and low density current on intermetallic compound growth rate in lead-free solder interface. %U http://dblp.uni-trier.de/db/journals/mr/mr54.html#ShenCZZH14 %V 54

@article{journals/mr/ShenCZZH14, added-at = {2014-08-06T00:00:00.000+0200}, author = {Shen, Jun and Cao, Zhongming and Zhai, Dajun and Zhao, Mali and He, Peipei}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2491d7f68eae33457e576ccc0016176ce/dblp}, ee = {http://dx.doi.org/10.1016/j.microrel.2013.09.005}, interhash = {d805eaf30d3793fe344feff80bb40a2b}, intrahash = {491d7f68eae33457e576ccc0016176ce}, journal = {Microelectronics Reliability}, keywords = {dblp}, number = 1, pages = {252-258}, timestamp = {2016-02-02T02:01:35.000+0100}, title = {Effect of isothermal aging and low density current on intermetallic compound growth rate in lead-free solder interface.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr54.html#ShenCZZH14}, volume = 54, year = 2014 }