%0 Conference Paper %1 conf/irps/HuKHMSOCPPASQGB18 %A Hu, C.-K. %A Kelly, James J. %A Huang, Huai %A Motoyama, Koji %A Shobha, Hosadurga %A Ostrovski, Y. %A Chen, J. H.-C. %A Patlolla, Raghuveer %A Peethala, Brown %A Adusumilli, Praneet %A Spooner, Terry A. %A Quon, Roger %A Gignac, L. M. %A Breslin, Chris M. %A Lian, G. %A Ali, M. %A Benedict, Jacob %A Lin, X. S. %A Smith, S. %A Kamineni, V. %A Zhang, X. %A Mont, Frank Wilhelm %A Siddiqui, S. %A Baumann, Frieder H. %B IRPS %D 2018 %I IEEE %K dblp %P 4 %T Future on-chip interconnect metallization and electromigration. %U http://dblp.uni-trier.de/db/conf/irps/irps2018.html#HuKHMSOCPPASQGB18 %@ 978-1-5386-5479-8

@inproceedings{conf/irps/HuKHMSOCPPASQGB18, added-at = {2019-01-22T00:00:00.000+0100}, author = {Hu, C.-K. and Kelly, James J. and Huang, Huai and Motoyama, Koji and Shobha, Hosadurga and Ostrovski, Y. and Chen, J. H.-C. and Patlolla, Raghuveer and Peethala, Brown and Adusumilli, Praneet and Spooner, Terry A. and Quon, Roger and Gignac, L. M. and Breslin, Chris M. and Lian, G. and Ali, M. and Benedict, Jacob and Lin, X. S. and Smith, S. and Kamineni, V. and Zhang, X. and Mont, Frank Wilhelm and Siddiqui, S. and Baumann, Frieder H.}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/26ba67d1678bf7bd329bc6fb9d4d34c1c/dblp}, booktitle = {IRPS}, crossref = {conf/irps/2018}, ee = {https://doi.org/10.1109/IRPS.2018.8353597}, interhash = {d7b4c947cd1e008421745e474593d19e}, intrahash = {6ba67d1678bf7bd329bc6fb9d4d34c1c}, isbn = {978-1-5386-5479-8}, keywords = {dblp}, pages = 4, publisher = {IEEE}, timestamp = {2019-09-27T13:33:22.000+0200}, title = {Future on-chip interconnect metallization and electromigration.}, url = {http://dblp.uni-trier.de/db/conf/irps/irps2018.html#HuKHMSOCPPASQGB18}, year = 2018 }