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%0 Journal Article
%1 journals/mr/SluisESDG07
%A van der Sluis, Olaf
%A Engelen, R. A. B.
%A van Silfhout, Richard B. R.
%A van Driel, W. D.
%A van Gils, M. A. J.
%D 2007
%J Microelectronics Reliability
%K dblp
%N 12
%P 1975-1982
%T Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion.
%U http://dblp.uni-trier.de/db/journals/mr/mr47.html#SluisESDG07
%V 47
@article{journals/mr/SluisESDG07,
added-at = {2010-09-17T00:00:00.000+0200},
author = {van der Sluis, Olaf and Engelen, R. A. B. and van Silfhout, Richard B. R. and van Driel, W. D. and van Gils, M. A. J.},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/253c72f71089c15d77939db5fe24d1774/dblp},
ee = {http://dx.doi.org/10.1016/j.microrel.2007.04.004},
interhash = {c0431acb786260bd95554ffd2167398f},
intrahash = {53c72f71089c15d77939db5fe24d1774},
journal = {Microelectronics Reliability},
keywords = {dblp},
number = 12,
pages = {1975-1982},
timestamp = {2016-02-02T02:00:49.000+0100},
title = {Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion.},
url = {http://dblp.uni-trier.de/db/journals/mr/mr47.html#SluisESDG07},
volume = 47,
year = 2007
}