Abstract
An assembly technology that has received little attention up to now in the area of microsensors is anisotropic conductive sticking, which is already state-of-the-art in the bonding of LCD displays. This procedure was investigated for a microsensors' application and used for a low pressure sensor as a practical example. In addition to an improvement in the tolerance to ambient media, the temperature-dependent offset drift could be reduced by a factor of about 10.
Users
Please
log in to take part in the discussion (add own reviews or comments).