%0 Journal Article %1 journals/asc/CuestaRAH15 %A Cuesta, David %A Risco-Martín, José L. %A Ayala, José L. %A Hidalgo, José Ignacio %D 2015 %J Appl. Soft Comput. %K dblp %P 164-177 %T Thermal-aware floorplanner for 3D IC, including TSVs, liquid microchannels and thermal domains optimization. %U http://dblp.uni-trier.de/db/journals/asc/asc34.html#CuestaRAH15 %V 34

@article{journals/asc/CuestaRAH15, added-at = {2015-07-25T00:00:00.000+0200}, author = {Cuesta, David and Risco-Martín, José L. and Ayala, José L. and Hidalgo, José Ignacio}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/20fa2f3db6b1c99612a79236caa1a3ce5/dblp}, ee = {http://dx.doi.org/10.1016/j.asoc.2015.04.052}, interhash = {b31944dcac13b53f71569f9be6cc70de}, intrahash = {0fa2f3db6b1c99612a79236caa1a3ce5}, journal = {Appl. Soft Comput.}, keywords = {dblp}, pages = {164-177}, timestamp = {2016-02-02T10:20:20.000+0100}, title = {Thermal-aware floorplanner for 3D IC, including TSVs, liquid microchannels and thermal domains optimization.}, url = {http://dblp.uni-trier.de/db/journals/asc/asc34.html#CuestaRAH15}, volume = 34, year = 2015 }