%0 Conference Paper %1 conf/irps/PayeCS15 %A Paye, Julie %A Claudi, Albert %A Stecher, Matthias %B IRPS %D 2015 %I IEEE %K dblp %P 5 %T High voltage robustness of mold compounds under different environmental conditions. %U http://dblp.uni-trier.de/db/conf/irps/irps2015.html#PayeCS15 %@ 978-1-4673-7362-3

@inproceedings{conf/irps/PayeCS15, added-at = {2016-03-07T00:00:00.000+0100}, author = {Paye, Julie and Claudi, Albert and Stecher, Matthias}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/20043defe1dff5ea1dd26d7c2e413123e/dblp}, booktitle = {IRPS}, crossref = {conf/irps/2015}, ee = {http://dx.doi.org/10.1109/IRPS.2015.7112792}, interhash = {b0a872689fc3c8f2a5a86ff5a93df6d4}, intrahash = {0043defe1dff5ea1dd26d7c2e413123e}, isbn = {978-1-4673-7362-3}, keywords = {dblp}, pages = 5, publisher = {IEEE}, timestamp = {2016-03-08T10:33:19.000+0100}, title = {High voltage robustness of mold compounds under different environmental conditions.}, url = {http://dblp.uni-trier.de/db/conf/irps/irps2015.html#PayeCS15}, year = 2015 }