Please log in to take part in the discussion (add own reviews or comments).
Cite this publication
More citation styles
- please select -
%0 Conference Paper
%1 conf/3dic/EidLRBFCGFCA09
%A Eid, Elie
%A Lacrevaz, Thierry
%A de Rivaz, Sébastien
%A Bermond, Cédric
%A Fléchet, Bernard
%A Calmon, Francis
%A Gontrand, Christian
%A Farcy, Alexis
%A Cadix, Lionel
%A Ancey, Pascal
%B 3DIC
%D 2009
%I IEEE
%K dblp
%P 1-6
%T Predictive High Frequency effects of substrate coupling in 3D integrated circuits stacking.
%U http://dblp.uni-trier.de/db/conf/3dic/3dic2009.html#EidLRBFCGFCA09
%@ 978-1-4244-4512-7
@inproceedings{conf/3dic/EidLRBFCGFCA09,
added-at = {2010-03-24T00:00:00.000+0100},
author = {Eid, Elie and Lacrevaz, Thierry and de Rivaz, Sébastien and Bermond, Cédric and Fléchet, Bernard and Calmon, Francis and Gontrand, Christian and Farcy, Alexis and Cadix, Lionel and Ancey, Pascal},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/28335f1cb435a0365afd5933968beb12d/dblp},
booktitle = {3DIC},
crossref = {conf/3dic/2009},
ee = {http://dx.doi.org/10.1109/3DIC.2009.5306547},
interhash = {a62af336044c9112f8a4e769e6134fc9},
intrahash = {8335f1cb435a0365afd5933968beb12d},
isbn = {978-1-4244-4512-7},
keywords = {dblp},
pages = {1-6},
publisher = {IEEE},
timestamp = {2016-02-02T14:29:06.000+0100},
title = {Predictive High Frequency effects of substrate coupling in 3D integrated circuits stacking.},
url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2009.html#EidLRBFCGFCA09},
year = 2009
}