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%0 Journal Article
%1 journals/mr/ChenGHSSLRE06
%A Chen, Fen
%A Gill, J.
%A Harmon, Dave
%A Sullivan, T.
%A Strong, A.
%A Li, B.
%A Rathore, H.
%A Edelstein, Daniel C.
%D 2006
%J Microelectronics Reliability
%K dblp
%N 2-4
%P 232-243
%T Determination of the thermal conductivity of composite low-k dielectrics for advanced interconnect structures.
%U http://dblp.uni-trier.de/db/journals/mr/mr46.html#ChenGHSSLRE06
%V 46
@article{journals/mr/ChenGHSSLRE06,
added-at = {2016-03-10T00:00:00.000+0100},
author = {Chen, Fen and Gill, J. and Harmon, Dave and Sullivan, T. and Strong, A. and Li, B. and Rathore, H. and Edelstein, Daniel C.},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2ba4cdc51ec72642aa94c122b89fbc3d9/dblp},
ee = {http://dx.doi.org/10.1016/j.microrel.2005.05.016},
interhash = {98edc7e519ba44a268ce541e50eab7db},
intrahash = {ba4cdc51ec72642aa94c122b89fbc3d9},
journal = {Microelectronics Reliability},
keywords = {dblp},
number = {2-4},
pages = {232-243},
timestamp = {2016-03-11T10:31:57.000+0100},
title = {Determination of the thermal conductivity of composite low-k dielectrics for advanced interconnect structures.},
url = {http://dblp.uni-trier.de/db/journals/mr/mr46.html#ChenGHSSLRE06},
volume = 46,
year = 2006
}