%0 Journal Article %1 journals/mr/VidekovTAI01 %A Videkov, Valentin %A Tzanova, Slavka %A Arnaudov, Radosvet %A Iordanov, Nikolai %D 2001 %J Microelectronics Reliability %K dblp %N 4 %P 611-615 %T New assembling technique for BGA packages without thermal processes. %U http://dblp.uni-trier.de/db/journals/mr/mr41.html#VidekovTAI01 %V 41

@article{journals/mr/VidekovTAI01, added-at = {2007-03-25T00:00:00.000+0100}, author = {Videkov, Valentin and Tzanova, Slavka and Arnaudov, Radosvet and Iordanov, Nikolai}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2b85d3e86a4e4dfe1b31ec4f5d6d8e52e/dblp}, ee = {http://dx.doi.org/10.1016/S0026-2714(00)00257-2}, interhash = {905f9be4fd22d5f45920701b58f501ef}, intrahash = {b85d3e86a4e4dfe1b31ec4f5d6d8e52e}, journal = {Microelectronics Reliability}, keywords = {dblp}, number = 4, pages = {611-615}, timestamp = {2016-02-02T02:01:27.000+0100}, title = {New assembling technique for BGA packages without thermal processes.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr41.html#VidekovTAI01}, volume = 41, year = 2001 }