%0 Conference Paper %1 conf/3dic/ItabashiKZZFTI11 %A Itabashi, Toshiaki %A Kotani, Masashi %A Zussman, Melvin P. %A Zoschke, K. %A Fischer, T. %A Topper, M. %A Ishida, Hiroyuki %B 3DIC %D 2011 %E Koyanagi, Mitsumasa %E Kada, Morihiro %I IEEE %K dblp %P 1-4 %T High temperature bonding solutions enabling thin wafer process and handling on 3D-IC manufacturing. %U http://dblp.uni-trier.de/db/conf/3dic/3dic2011.html#ItabashiKZZFTI11 %@ 978-1-4673-2189-1

@inproceedings{conf/3dic/ItabashiKZZFTI11, added-at = {2012-09-05T00:00:00.000+0200}, author = {Itabashi, Toshiaki and Kotani, Masashi and Zussman, Melvin P. and Zoschke, K. and Fischer, T. and Topper, M. and Ishida, Hiroyuki}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/29659855a3bd60cd5b1cec7b656ed9a32/dblp}, booktitle = {3DIC}, crossref = {conf/3dic/2011}, editor = {Koyanagi, Mitsumasa and Kada, Morihiro}, ee = {http://dx.doi.org/10.1109/3DIC.2012.6263003}, interhash = {79cabfdf1a7aa91562020514146ed29c}, intrahash = {9659855a3bd60cd5b1cec7b656ed9a32}, isbn = {978-1-4673-2189-1}, keywords = {dblp}, pages = {1-4}, publisher = {IEEE}, timestamp = {2016-02-02T14:29:09.000+0100}, title = {High temperature bonding solutions enabling thin wafer process and handling on 3D-IC manufacturing.}, url = {http://dblp.uni-trier.de/db/conf/3dic/3dic2011.html#ItabashiKZZFTI11}, year = 2011 }