%0 Journal Article %1 kuczynska2021effect %A Kuczynska, Marta %A Maniar, Youssef %A Becker, U. %A Weihe, Stefan %D 2021 %I Elsevier %J Microelectronics reliability %K mult ubs_10004 ubs_10014 ubs_20004 ubs_30047 ubs_40074 unibibliografie wos %N May %P 114101 %R 10.1016/j.microrel.2021.114101 %T Effect of shear and tensile-dominant cyclic loading on failure in SnAgCu solder %V 120

@article{kuczynska2021effect, added-at = {2022-04-14T15:19:46.000+0200}, affiliation = {Kuczynska, M (Corresponding Author), Robert Bosch GmbH, Automot Elect Div, Postfach 300240, D-70442 Stuttgart, Germany. Kuczynska, M.; Becker, U., Robert Bosch GmbH, Automot Elect Div, Postfach 300240, D-70442 Stuttgart, Germany. Maniar, Y., Robert Bosch GmbH, Corp Res Div, Postfach 300240, D-70442 Stuttgart, Germany. Maniar, Y., Univ Stuttgart, Inst Mat Testing Mat Sci & Strength Mat IMWF, D-70569 Stuttgart, Germany. Kuczynska, M.; Weihe, S., Univ Stuttgart, Mat Testing Inst MPA, Pfaffenwaldring 32, D-70569 Stuttgart, Germany.}, author = {Kuczynska, Marta and Maniar, Youssef and Becker, U. and Weihe, Stefan}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/287ea4b3070cb89ee84c3d18f86ad2746/unibiblio}, doi = {10.1016/j.microrel.2021.114101}, interhash = {711a706cfaefdae8e5b52a19fc3f8295}, intrahash = {87ea4b3070cb89ee84c3d18f86ad2746}, issn = {0026-2714}, journal = {Microelectronics reliability}, keywords = {mult ubs_10004 ubs_10014 ubs_20004 ubs_30047 ubs_40074 unibibliografie wos}, language = {eng}, number = {May}, pages = 114101, publisher = {Elsevier}, research-areas = {Engineering; Science & Technology - Other Topics; Physics}, timestamp = {2022-04-14T13:19:46.000+0200}, title = {Effect of shear and tensile-dominant cyclic loading on failure in SnAgCu solder}, unique-id = {ISI:000663147500011}, volume = 120, year = 2021 }