%0 Journal Article %1 journals/tcad/LiPAC06 %A Li, Peng %A Pileggi, Lawrence T. %A Asheghi, Mehdi %A Chandra, Rajit %D 2006 %J IEEE Trans. on CAD of Integrated Circuits and Systems %K dblp %N 9 %P 1763-1776 %T IC thermal simulation and modeling via efficient multigrid-based approaches. %U http://dblp.uni-trier.de/db/journals/tcad/tcad25.html#LiPAC06 %V 25

@article{journals/tcad/LiPAC06, added-at = {2016-03-18T00:00:00.000+0100}, author = {Li, Peng and Pileggi, Lawrence T. and Asheghi, Mehdi and Chandra, Rajit}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/25630e90045342b20f05cb45f2ed25008/dblp}, ee = {http://dx.doi.org/10.1109/TCAD.2005.858276}, interhash = {6f8f7961c79701c4833c1e34fc874f11}, intrahash = {5630e90045342b20f05cb45f2ed25008}, journal = {IEEE Trans. on CAD of Integrated Circuits and Systems}, keywords = {dblp}, number = 9, pages = {1763-1776}, timestamp = {2016-03-19T10:33:15.000+0100}, title = {IC thermal simulation and modeling via efficient multigrid-based approaches.}, url = {http://dblp.uni-trier.de/db/journals/tcad/tcad25.html#LiPAC06}, volume = 25, year = 2006 }