%0 Journal Article %1 journals/mr/TsaiLCCWH16 %A Tsai, M. Y. %A Lin, C. H. %A Chuang, K. F. %A Chang, Y. H. %A Wu, C. T. %A Hu, S. C. %D 2016 %J Microelectronics Reliability %K dblp %P 120-128 %T Failure and stress analysis of through-aluminum-nitride-via substrates during thermal reliability tests for high power LED applications. %U http://dblp.uni-trier.de/db/journals/mr/mr67.html#TsaiLCCWH16 %V 67

@article{journals/mr/TsaiLCCWH16, added-at = {2016-12-14T00:00:00.000+0100}, author = {Tsai, M. Y. and Lin, C. H. and Chuang, K. F. and Chang, Y. H. and Wu, C. T. and Hu, S. C.}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2417cdc064db0aeaa1b0f609621bba994/dblp}, ee = {http://dx.doi.org/10.1016/j.microrel.2016.11.005}, interhash = {5b089350b5f96856fdd9a4f7c23c92c5}, intrahash = {417cdc064db0aeaa1b0f609621bba994}, journal = {Microelectronics Reliability}, keywords = {dblp}, pages = {120-128}, timestamp = {2016-12-15T10:32:29.000+0100}, title = {Failure and stress analysis of through-aluminum-nitride-via substrates during thermal reliability tests for high power LED applications.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr67.html#TsaiLCCWH16}, volume = 67, year = 2016 }