%0 Conference Paper %1 conf/iccad/PakLP12 %A Pak, Jiwoo %A Lim, Sung Kyu %A Pan, David Z. %B ICCAD %D 2012 %E Hu, Alan J. %I ACM %K dblp %P 325-332 %T Electromigration-aware routing for 3D ICs with stress-aware EM modeling. %U http://dblp.uni-trier.de/db/conf/iccad/iccad2012.html#PakLP12 %@ 978-1-4577-1398-9

@inproceedings{conf/iccad/PakLP12, added-at = {2018-11-06T00:00:00.000+0100}, author = {Pak, Jiwoo and Lim, Sung Kyu and Pan, David Z.}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2dd8d158593ce62d52f4919e435ee4003/dblp}, booktitle = {ICCAD}, crossref = {conf/iccad/2012}, editor = {Hu, Alan J.}, ee = {http://ieeexplore.ieee.org/document/6386630/}, interhash = {5a90d4a12787fd6adf5b7fa22776d18d}, intrahash = {dd8d158593ce62d52f4919e435ee4003}, isbn = {978-1-4577-1398-9}, keywords = {dblp}, pages = {325-332}, publisher = {ACM}, timestamp = {2019-09-27T15:54:58.000+0200}, title = {Electromigration-aware routing for 3D ICs with stress-aware EM modeling.}, url = {http://dblp.uni-trier.de/db/conf/iccad/iccad2012.html#PakLP12}, year = 2012 }