%0 Conference Paper %1 conf/asicon/HouFWG0G15 %A Hou, Ligang %A Fu, Jingyan %A Wang, Jinhui %A Gong, Na %A Zhao, Wei %A Geng, Shuqin %B ASICON %D 2015 %I IEEE %K dblp %P 1-3 %T A thermal-aware distribution method of TSV in 3D IC. %U http://dblp.uni-trier.de/db/conf/asicon/asicon2015.html#HouFWG0G15 %@ 978-1-4799-8485-5

@inproceedings{conf/asicon/HouFWG0G15, added-at = {2018-07-17T00:00:00.000+0200}, author = {Hou, Ligang and Fu, Jingyan and Wang, Jinhui and Gong, Na and Zhao, Wei and Geng, Shuqin}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2fe090d18acbc07c72b909e1664895556/dblp}, booktitle = {ASICON}, crossref = {conf/asicon/2015}, ee = {https://doi.org/10.1109/ASICON.2015.7517067}, interhash = {56af8eb9a2bb3956e7c6ca40e900ce3f}, intrahash = {fe090d18acbc07c72b909e1664895556}, isbn = {978-1-4799-8485-5}, keywords = {dblp}, pages = {1-3}, publisher = {IEEE}, timestamp = {2019-09-27T17:19:01.000+0200}, title = {A thermal-aware distribution method of TSV in 3D IC.}, url = {http://dblp.uni-trier.de/db/conf/asicon/asicon2015.html#HouFWG0G15}, year = 2015 }