%0 Conference Paper %1 schuessler2008molded %A Schueßler, Florian %A Feldmann, Klaus %A Kueck, Heinz %A Richter, H. %A Osswald, Tim %A Gardocki, A. %D 2008 %K ifm_conf kueck %T Molded Interconnect Devices for Applications with Advanced Thermal Requirements

@inproceedings{schuessler2008molded, added-at = {2023-07-10T18:19:07.000+0200}, author = {Schueßler, Florian and Feldmann, Klaus and Kueck, Heinz and Richter, H. and Osswald, Tim and Gardocki, A.}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2fd7f81df21545353d0d9324bb52a4703/holgerruehl}, eventtitle = {8th International Congress Molded Interconnect Devices}, interhash = {50da32effcdf64794fb0784468c935ce}, intrahash = {fd7f81df21545353d0d9324bb52a4703}, keywords = {ifm_conf kueck}, month = {09}, timestamp = {2023-07-10T18:19:07.000+0200}, title = {Molded Interconnect Devices for Applications with Advanced Thermal Requirements}, venue = {Fuerth}, year = 2008 }