%0 Journal Article %1 journals/mr/HotchkissAEHSSH01 %A Hotchkiss, Greg %A Amador, Gonzalo %A Edwards, Darvin %A Hundt, Paul %A Stark, Les %A Stierman, Roger %A Heinen, Gail %D 2001 %J Microelectronics Reliability %K dblp %N 5 %P 705-713 %T Wafer level packaging of a tape flip-chip chip scale packages. %U http://dblp.uni-trier.de/db/journals/mr/mr41.html#HotchkissAEHSSH01 %V 41

@article{journals/mr/HotchkissAEHSSH01, added-at = {2007-03-25T00:00:00.000+0100}, author = {Hotchkiss, Greg and Amador, Gonzalo and Edwards, Darvin and Hundt, Paul and Stark, Les and Stierman, Roger and Heinen, Gail}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2b19df3e302a96fad0c3b5f73347e800f/dblp}, ee = {http://dx.doi.org/10.1016/S0026-2714(00)00261-4}, interhash = {509298aeb7fd3b14b59aa7c48467aa27}, intrahash = {b19df3e302a96fad0c3b5f73347e800f}, journal = {Microelectronics Reliability}, keywords = {dblp}, number = 5, pages = {705-713}, timestamp = {2016-02-02T02:01:42.000+0100}, title = {Wafer level packaging of a tape flip-chip chip scale packages.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr41.html#HotchkissAEHSSH01}, volume = 41, year = 2001 }