%0 Journal Article %1 journals/mr/CuiCLZCY15 %A Cui, Zaifu %A Cai, Miao %A Li, Ruifeng %A Zhang, Ping %A Chen, Xianping %A Yang, Dao-Guo %D 2015 %J Microelectronics Reliability %K dblp %N 9-10 %P 1877-1881 %T A numerical procedure for simulating thermal oxidation diffusion of epoxy molding compounds. %U http://dblp.uni-trier.de/db/journals/mr/mr55.html#CuiCLZCY15 %V 55

@article{journals/mr/CuiCLZCY15, added-at = {2019-09-25T00:00:00.000+0200}, author = {Cui, Zaifu and Cai, Miao and Li, Ruifeng and Zhang, Ping and Chen, Xianping and Yang, Dao-Guo}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/28ed0e92c9dc17527e7aeae969270e92d/dblp}, ee = {https://doi.org/10.1016/j.microrel.2015.06.112}, interhash = {48f2e4cae742d3fc8a20d620e4edc665}, intrahash = {8ed0e92c9dc17527e7aeae969270e92d}, journal = {Microelectronics Reliability}, keywords = {dblp}, number = {9-10}, pages = {1877-1881}, timestamp = {2019-09-27T10:58:29.000+0200}, title = {A numerical procedure for simulating thermal oxidation diffusion of epoxy molding compounds.}, url = {http://dblp.uni-trier.de/db/journals/mr/mr55.html#CuiCLZCY15}, volume = 55, year = 2015 }