%0 Conference Paper %1 conf/iccad/PakLP13 %A Pak, Jiwoo %A Lim, Sung Kyu %A Pan, David Z. %B ICCAD %D 2013 %E Henkel, Jörg %I IEEE %K dblp %P 379-386 %T Electromigration study for multi-scale power/ground vias in TSV-based 3D ICs. %U http://dblp.uni-trier.de/db/conf/iccad/iccad2013.html#PakLP13 %@ 978-1-4799-1069-4

@inproceedings{conf/iccad/PakLP13, added-at = {2015-04-30T00:00:00.000+0200}, author = {Pak, Jiwoo and Lim, Sung Kyu and Pan, David Z.}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/232989dd59ee37537dbaf942b4752cc42/dblp}, booktitle = {ICCAD}, crossref = {conf/iccad/2013}, editor = {Henkel, Jörg}, ee = {http://dl.acm.org/citation.cfm?id=2561904}, interhash = {48b54d7979fe6948e4c0a1a0a780bc04}, intrahash = {32989dd59ee37537dbaf942b4752cc42}, isbn = {978-1-4799-1069-4}, keywords = {dblp}, pages = {379-386}, publisher = {IEEE}, timestamp = {2016-02-02T13:49:30.000+0100}, title = {Electromigration study for multi-scale power/ground vias in TSV-based 3D ICs.}, url = {http://dblp.uni-trier.de/db/conf/iccad/iccad2013.html#PakLP13}, year = 2013 }