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%0 Journal Article
%1 journals/tcad/LiuSTCW14
%A Liu, Zao
%A Swarup, Sahana
%A Tan, Sheldon X.-D.
%A Chen, Hai-Bao
%A Wang, Hai
%D 2014
%J IEEE Trans. on CAD of Integrated Circuits and Systems
%K dblp
%N 10
%P 1490-1502
%T Compact Lateral Thermal Resistance Model of TSVs for Fast Finite-Difference Based Thermal Analysis of 3-D Stacked ICs.
%U http://dblp.uni-trier.de/db/journals/tcad/tcad33.html#LiuSTCW14
%V 33
@article{journals/tcad/LiuSTCW14,
added-at = {2014-09-30T00:00:00.000+0200},
author = {Liu, Zao and Swarup, Sahana and Tan, Sheldon X.-D. and Chen, Hai-Bao and Wang, Hai},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/268896f3625808f52935050f9280a84e6/dblp},
ee = {http://dx.doi.org/10.1109/TCAD.2014.2334321},
interhash = {41ee51db036eedf3ea4a29311c1064ee},
intrahash = {68896f3625808f52935050f9280a84e6},
journal = {IEEE Trans. on CAD of Integrated Circuits and Systems},
keywords = {dblp},
number = 10,
pages = {1490-1502},
timestamp = {2016-02-02T10:07:47.000+0100},
title = {Compact Lateral Thermal Resistance Model of TSVs for Fast Finite-Difference Based Thermal Analysis of 3-D Stacked ICs.},
url = {http://dblp.uni-trier.de/db/journals/tcad/tcad33.html#LiuSTCW14},
volume = 33,
year = 2014
}
