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%0 Journal Article
%1 journals/ibmrd/AndricacosUDHD98
%A Andricacos, Panayotis C.
%A Uzoh, Cyprian
%A Dukovic, John O.
%A Horkans, Jean
%A Deligianni, Hariklia
%D 1998
%J IBM Journal of Research and Development
%K dblp
%N 5
%P 567-574
%T Damascene copper electroplating for chip interconnections.
%U http://dblp.uni-trier.de/db/journals/ibmrd/ibmrd42.html#AndricacosUDHD98
%V 42
@article{journals/ibmrd/AndricacosUDHD98,
added-at = {2008-08-13T00:00:00.000+0200},
author = {Andricacos, Panayotis C. and Uzoh, Cyprian and Dukovic, John O. and Horkans, Jean and Deligianni, Hariklia},
biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2eaa6a0c4f82e3c3725a8b8e9be63dcd6/dblp},
ee = {http://dx.doi.org/10.1147/rd.425.0567},
interhash = {3e4a512ea0af0fc60af72a16cda88bcd},
intrahash = {eaa6a0c4f82e3c3725a8b8e9be63dcd6},
journal = {IBM Journal of Research and Development},
keywords = {dblp},
number = 5,
pages = {567-574},
timestamp = {2016-02-02T08:59:11.000+0100},
title = {Damascene copper electroplating for chip interconnections.},
url = {http://dblp.uni-trier.de/db/journals/ibmrd/ibmrd42.html#AndricacosUDHD98},
volume = 42,
year = 1998
}
