%0 Conference Paper %1 conf/iccad/MizunumaYL09 %A Mizunuma, Hitoshi %A Yang, Chia-Lin %A Lu, Yi-Chang %B ICCAD %D 2009 %E Roychowdhury, Jaijeet S. %I ACM %K dblp %P 256-263 %T Thermal modeling for 3D-ICs with integrated microchannel cooling. %U http://dblp.uni-trier.de/db/conf/iccad/iccad2009.html#MizunumaYL09 %@ 978-1-60558-800-1

@inproceedings{conf/iccad/MizunumaYL09, added-at = {2018-11-06T00:00:00.000+0100}, author = {Mizunuma, Hitoshi and Yang, Chia-Lin and Lu, Yi-Chang}, biburl = {https://puma.ub.uni-stuttgart.de/bibtex/2f0129d712689c12e1fd0a16051a082cb/dblp}, booktitle = {ICCAD}, crossref = {conf/iccad/2009}, editor = {Roychowdhury, Jaijeet S.}, ee = {http://ieeexplore.ieee.org/document/5361284/}, interhash = {309f908094f5c8e5a8be68f783687d90}, intrahash = {f0129d712689c12e1fd0a16051a082cb}, isbn = {978-1-60558-800-1}, keywords = {dblp}, pages = {256-263}, publisher = {ACM}, timestamp = {2019-09-27T15:54:41.000+0200}, title = {Thermal modeling for 3D-ICs with integrated microchannel cooling.}, url = {http://dblp.uni-trier.de/db/conf/iccad/iccad2009.html#MizunumaYL09}, year = 2009 }